There are abundant studies on deformation mechanisms in metallic materials dominated by
grain boundaries and twin boundaries. In comparison, the influence of stacking faults on …

Nanostructured metals are usually strong because the ultrahigh density of internal
boundaries restricts the mean free path of dislocations. Usually, they are also more brittle …

Copper is the most common interconnecting material in the field of microelectronic
packaging, which is widely used in advanced electronic packaging technologies. However …

The effect of thermo-mechanical processing on the evolution of microstructure and
mechanical properties was investigated in an AlCoCrFeNi 2.1 high entropy alloy. For this …

Nearly 90 per cent of service failures of metallic components and structures are caused by
fatigue at cyclic stress amplitudes much lower than the tensile strength of the materials …

Nanotwinned metals are attractive in many applications because they simultaneously
demonstrate high strength and high ductility, characteristics that are usually thought to be …

An overview is given of the deformation mechanisms in nanotwinned copper, as studied by
recent molecular dynamics, dislocation mechanics and crystal plasticity modeling. We …

To understand the underlying mechanisms that control the mechanical properties of
nanostructured metals, an insight into the role of the grain boundary in dislocation-driven …

By means of direct current electrodeposition nanoscale twins confined within microsized
columnar grains of bulk Cu samples have been synthesized which are preferentially …

A high-resolution electron backscatter diffraction technique was applied to quantify grain-
structure development and texture evolution during/after cryogenic rolling of pure copper …