Through-silicon via (TSV) crack sensors for detecting TSV cracks in three-dimensional (3D) integrated circuits (ICs)(3DICs), and related methods and systems
SK Lim, R Radojcic, Y Du - US Patent 9,869,713, 2018 - Google Patents
Through-silicon via (TSV) crack sensors for detecting TSV cracks in three-dimensional (3D)
integrated circuits (ICs)(3DICs), and related methods and systems are disclosed. In one …
integrated circuits (ICs)(3DICs), and related methods and systems are disclosed. In one …
A compressive-sensing based testing vehicle for 3D TSV pre-bond and post-bond testing data
Online testing vehicle is required for 3D TSV pre-bond and post-bond testing due to high
probability of TSV failures. It has become a challenge to deal with large sets of generated …
probability of TSV failures. It has become a challenge to deal with large sets of generated …
A novel entropy production based full-chip TSV fatigue analysis
Through-silicon vias (TSVs) are subject to thermal fatigue due to stress over time, no matter
how small the stress is. Existing works on TSV fatigue all rely on measurement-based …
how small the stress is. Existing works on TSV fatigue all rely on measurement-based …
Memcomputing: The cape of good hope:[Extended special session description]
Energy efficiency has emerged as a major barrier to performance scalability for modern
processors. On the other hand, significant breakthroughs have been achieved in memory …
processors. On the other hand, significant breakthroughs have been achieved in memory …
Live Free or Die Hard: Design for Reliability in 3D Integrated Circuits
In this chapter, we discuss the reliability issues about 3D-ICs fabrication process under
technologies nowadays, and propose possible solutions to address the problems. In Section …
technologies nowadays, and propose possible solutions to address the problems. In Section …
9 Live Free or Die Hard
In this chapter, we discuss the reliability issues about 3D-ICs fabrication process under
technologies nowadays, and propose possible solutions to address the problems. In Section …
technologies nowadays, and propose possible solutions to address the problems. In Section …