Ceramic materials are widely used in engineering field because of their good physical and
chemical properties. The poor mechanical properties of traditional ceramics seriously limit …

In order to achieve high efficiency and low damage processing of hard and brittle materials,
composite ultrasonic vibration-assisted face grinding (CUVAFG) has been proposed by …

Electrochemical discharge machining (ECDM) is a hybrid machining process capable of
micromachining conductive and nonconductive materials. The recent development and …

Single-point diamond turning (SPDT) is an essential machining method for brittle single-
crystal materials (BSCMs) to obtain desired surface morphologies. However, the ductile …

The surging demand for monocrystalline silicon materials in the production of
microelectronic components highlights its crucial role in the semiconductor and optic …

This paper presents an investigation into the machining of CFRP composites using rotary
ultrasonic machining. The study aims to analyze how various process parameters influence …

Residual stresses are defined as the stresses that occur in the material without the
application of an external load. Their occurrence is related to the technology of production …

This work investigates the wear behavior of nickel-based alloy during ultrasonic vibration-
assisted machining (UVAM) by combining molecular dynamics simulation and …

In recent years, semiconductors, electronics, optics, and various other industries have seen
a significant surge in the use of sapphire materials, driven by their exceptional mechanical …

Aiming at the problems of low machining accuracy and more serious tool wear in the
traditional diamond grinding machining (DGM) microstructure of hard and brittle materials …