With the implementation of legislations on inhibiting the usage of Sn–Pb solder in consumer
electronic products, Sn–Ag–Cu series solder has been gotten the most application …

Abstract The Fe–Sn-based kagome compounds attract intensive attention due to its
attractive topological transport and rich magnetic properties. Combining experimental data …

The usage of low-grade ferrous scrap has increased over decades to decrease CO 2
emissions and to produce steel products at a low cost. A serious problem in melting post …

Purpose This study aims to address the problem of low-temperature wave soldering in
industry production with Sn-9Zn-2.5 Bi-1.5 In alloys and develop qualified process …

Abstract The Fe–Sn–Zr system has been studied by first principles calculation and modelled
with the Calphad method using the literature and new experimental data. The work includes …

The isothermal sections of Al–Fe–Sn ternary system at 973 and 593 K were determined
experimentally by the equilibriated alloy method using scanning electron microscopy …

To provide fundamental understanding for the solid-liquid interdiffusion process using
indium-based solders, interfacial reactions in the Co/In, In/Cu, Ni/In, Co/In/Cu and Ni/In/Cu …

Abstract The Mg–Pt system is considered as a promising hydrogen storage material.
Surprisingly, its phase diagram is unknown hence application of this alloy very limited due to …

This work presents the results of electromotive force measurements, by coulometric titration
technique, for liquid and solid Mg-Pd alloys with concentrations up to 0.70 mole fraction of …

In the present paper, the wide miscibility gap in liquid phase in the Al-Fe-Sn system is well
defined for the first time. A large miscibility gap extends from the Sn single bondFe side and …