Military troops rely on maintenance management projects and operations to preserve the
materials' ordinary conditions or restore them to combat or military training. Maintenance …

ABSTRACT A method for non-destructively tracking the integrity of flip chip solder joints
through life is investigated in this paper. An industry standard double-sided PCB was …

This paper compares three prognostic algorithms applied to the same data recorded during
the failure of a solder joint in ball grid array component attached to a printed circuit board …

Ball grid array (BGA) packages have rapidly become the popular choice of manufacturers in
the semiconductor industry over the past decade. The characteristics of BGA packages in a …

Relatively little is known about the performance of the doped Ball Grid Array (BGA)
packages used in semiconductor industries, even though newer products are widely being …

Electronic systems may be subjected to prolonged and intermittent periods of storage prior
to deployment or usage. Prior studies have shown that leadfree solder interconnects show …

Electronics in high reliability applications may be subjected to cyclic thermo-mechanical
loads after being deployed for extended periods of time in harsh environment. Cyclic thermal …

This doctoral thesis aims to address the quantitative monitoring and prediction of system
deterioration through data-driven approaches. The focus is directed towards two crucial …

Electronics in automotive underhood applications may be subjected to temperatures in the
neighborhood of 150° C to 175° C. Several electronic functions such as lane departure …

Military operations presuppose the use of a large amount of armament, supplies, and
equipment that need to be ready for the maneuvers on the battleield. In order to achieve it …