Level one electronics packaging is traditionally defined as the design and production of the
encapsulating structure that provides mechanical support, environmental protection …

Comprehensive understandings for the resistivity− temperature behavior of high-entropy
alloy (HEA) films is crucial for assessing their potential as thin-film resistive materials. But …

Room-temperature fabrication of TiO 2/Cu composite films for embedded passive
components were attempted via aerosol deposition process. XRD analysis and observation …

In this paper, a series of TaCN composite films with different carbon content were deposited
by the magnetron sputtering system and the microstructure, mechanical and tribological …

Abstract Large area (A= 6 cm 2), thin tantalum films (5 nm< d< 100 nm) are accomplished by
evaporation from tantalum rods using small pocket e-beam evaporators. Using a sample to …

A series of TaWN films with different W contents were prepared using reaction magnetron
sputtering, and the microstructure, mechanical and tribological properties were investigated …

Diamond, renowned for its exceptional heat dissipation properties, stands out as an optimal
substrate for tantalum nitride (Ta 2 N) film resistors. To fully exploit the high thermal …

TaNx thin films were deposited on commercial polished Al2O3 ceramic substrates by
reactive dc magnetron sputtering. The influences of the film thickness on the electrical …

In deposition of nitride films through reactive sputtering, the degree of nitrogen dissociation
from N 2 in vacuum chambers is small and difficult to control, while the nitrogen sputtered …

This paper explores the key developments in thin film resistive materials for use in the
fabrication of discrete precision resistors. Firstly an introduction to the preparation of thin …