This paper provides a broad review of the cooling technologies for computer products from
desktop computers to large servers. For many years cooling technology has played a key …

System-on-Package (SOP) technology based on silicon carriers has the potential to provide
modular design flexibility and high-performance integration of heterogeneous chip …

System-on-Chip (SOC) and System-on-Package (SOP) technologies each have advantages
depending on application needs. As system architects and designers leverage ever …

Packaged semiconductor assemblies including interconnect structures and methods for
forming Such interconnect struc tures are disclosed herein. One embodiment of a packaged …

The high-performance server compute landscape is changing. The traditional model of
building general-purpose enterprise compute boxes that end-users can configure with …

In Thermal and Power Management of Integrated Circuits, power and thermal management
issues in integrated circuits during normal operating conditions and stress operating …

Thermoelectric devices are currently being used in the applications of cooling and
generating electricity. This study mainly focuses on using these devices for both applications …

Cooling technologies that address high-density and asymmetric heat dissipation in CPU
packages of high-performance servers are discussed. Thermal management schemes and …

Enhanced boiling of HFE-7100 dielectric liquid on porous graphite measuring 10mm×
10mm is investigated, and results are compared with those for smooth copper (Cu) of the …

Based on a variety of optimization criteria, recent research has suggested that optical
interconnects are a viable alternative to electrical interconnects for board-to-board, chip-to …