The present review on thermal stresses in materials with temperature-dependent properties
focuses on papers published after 1980. The thermal and mechanical properties in materials …

The response of structures and materials subject to impulsive loads remains a field of
intense research. The dynamic loading and temperature increase affect the material's …

A Taylor-type polycrystalline model, together with a new fully-implicit time-integration
scheme has been developed and implemented in a finite element program to simulate the …

A set of internal variable type constitutive equations which model large elastic-viscoplastic
deformations of metals at high temperatures is formulated. For a first-order representation of …

Elevated temperature deformation processing-“hot-working,” is an important step during the
manufacturing of most metal products. Central to any successful analysis of a hot-working …

An empirical plasticity constitutive form describing the flow stress as a function of strain,
strain-rate, and temperature has been developed, fit to data for three dual-phase (DP) steels …

As temperature cycling drives fatigue failure of solder joints in electronic modules,
characterisation of the thermal fatigue response of different solder alloy formulations in BGA …

The simplest way to formulate the basic equations of continuum mech-ics and the
constitutive or evolutional equations of various materials is to restrict ourselves to …

The Anand viscoplastic constitutive model is often used to represent the deformation
behavior of solders in electronic assemblies. In the Anand model, plasticity and creep are …

To estimate the cracking condition in continuously cast steels, a new model for critical
fracture stress given from the measured critical strain has been proposed, which can take …