Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit
Boards and Packaging presents the electromagnetic modelling and design of three major …

An equivalent-circuit model of shield differential through-silicon vias (SDTSVs) in 3-D
integrated circuits (3-D ICs) is proposed in this paper. The proposed model is verified using …

This article proposes a novel differential through-silicon via (D-TSV) structure, which is filled
with vertically aligned carbon nanotube (VACNT) array. Two metal pads are deposited on …

For annular through-silicon via (TSV)-based 3-D integrated circuits (3-D ICs), a greater TSV
metal proportion of annular TSV leads to lower temperature but induces larger keep-out …

In this paper, we, for the first time, designed and analyzed differential high-speed serial links
of the silicon interposer including differential through-silicon-via (TSV) channels for a high …

This paper presents an effective loop impedance extraction method and a model of a signal
through-silicon via (TSV) surrounded by multiground TSVs. According to this method, the …

This paper presents the wideband modeling and analysis of differential through-silicon vias
(D-TSVs) in 3-D ICs. An equivalent-circuit model of the ground-signal-signal-ground-type D …

A bandwidth optimization model for a novel equivalent 90° transmission-line section is
proposed in this paper. Furthermore, the structure of 3-D compact 3-dB branch-line …

An equivalent circuit model for the transient analysis of through-silicon vias (TSV) taking into
account nonlinear metal-oxide-semiconductor effects is proposed. The model takes into …

In this work, we propose a deep reinforcement learning (DRL) framework called Pin-opt,
designed to create a reusable solver capable of optimizing pin assignment to minimize …