Survey on fatigue life prediction of BGA solder joints
B Qiu, J Xiong, H Wang, S Zhou, X Yang, Z Lin, M Liu… - Electronics, 2022 - mdpi.com
With the development of science and technology, consumers' requirements for various
electronic devices present a trend of more diverse functions and thinner bodies. This makes …
electronic devices present a trend of more diverse functions and thinner bodies. This makes …
A state-of-the-art review of fatigue life prediction models for solder joint
Fatigue failure of solder joints is one of the major causes of failure in electronic devices.
Fatigue life prediction models of solder joints were first put forward in the early 1960s, and …
Fatigue life prediction models of solder joints were first put forward in the early 1960s, and …
Interaction of thermal cycling and electric current on reliability of solder joints in different solder balls
Y Jiao, K Jermsittiparsert… - Materials Research …, 2019 - iopscience.iop.org
This paper deals with the effects of electric current on the thermomechanical lifetime of
solder joint as the most vulnerable part in electronic packages. The main focus of this paper …
solder joint as the most vulnerable part in electronic packages. The main focus of this paper …
Shear and fatigue properties of lead-free solder joints: Modeling and microstructure analysis
Abstract The reliability of Sn-Ag-Cu (SAC)-based solder alloys has been extensively
investigated after the prohibition of lead in the electronics industry owing to their toxicity. Low …
investigated after the prohibition of lead in the electronics industry owing to their toxicity. Low …
Application of steinberg model for vibration lifetime evaluation of Sn-Ag-Cu-based solder joints in power semiconductors
Steinberg-equation-based vibration mechanical fatigue lifetime estimation of the Sn-Ag-Cu-
based solder joints was extracted for the power semiconductor modules. In this model …
based solder joints was extracted for the power semiconductor modules. In this model …
Analysis and modeling of aged SAC-Bi solder joints subjected to varying stress cycling conditions
Solder joints are subjected to varied stress cycle circumstances in the electronic packaging
service life but are also influenced by aging. There has been limited investigation into the …
service life but are also influenced by aging. There has been limited investigation into the …
Fatigue performance and microstructure of lead-free solder joints in BGA assembly at room temperature
One of the crucial factors in evaluating the reliability of an electronic appliance is fatigue
failure of the interconnecting solder joints. In most situations, large bulk samples are used to …
failure of the interconnecting solder joints. In most situations, large bulk samples are used to …
Assessing the SAC305 solder joint fatigue in ball grid array assembly using strain-controlled and stress-controlled approaches
One of the crucial factors in determining the reliability of an electronic device is fatigue
failure of the interconnecting solder joints. In most cases, large bulk samples are used to …
failure of the interconnecting solder joints. In most cases, large bulk samples are used to …
Reliability modeling for aged SAC305 solder joints cycled in accelerated shear fatigue test
Solder joints reliability is a determinant factor for the life of the electronic assemblies. In this
study, the reliability of actual SAC305 solder joints is investigated using accelerated shear …
study, the reliability of actual SAC305 solder joints is investigated using accelerated shear …
Fatigue behavior of SAC-Bi and SAC305 solder joints with aging
R Al Athamneh - IEEE Transactions on Components …, 2019 - ieeexplore.ieee.org
Reliability of microelectronic assemblies is typically limited by the fatigue failure of one of the
interconnected solder joints. The fatigue behavior of the lead-free solder joints doped with …
interconnected solder joints. The fatigue behavior of the lead-free solder joints doped with …