The recent advances and trends in fan-out wafer/panel-level packaging (FOW/PLP) are
presented in this study. Emphasis is placed on:(A) the package formations such as (a) chip …

Thermal metamaterials exhibit thermal properties that do not exist in nature but can be
rationally designed to offer unique capabilities of controlling heat transfer. Recent advances …

The novel low-temperature Cu/SiO 2 hybrid bonding scheme using cluster-Ag passivation
has been proposed in this study for the heterogeneous integration application. With the …

Organic interposer (CoWoS-R) technology is one of the most promising heterogeneous
integration platforms for high performance computing (HPC) applications. Components such …

The recent advances and trends in heterogeneous integrations are presented in this study.
Emphasis is placed on:(A) the definition of heterogeneous integrations,(B) the classifications …

In this investigation, the chip-last, redistribution-layer (RDL)–first, fan-out panel-level
packaging (FOPLP) for heterogeneous integration is studied. Emphasis is placed on the …

Next-generation electronic packaging strategies like heterogeneous integration packaging
necessitate low melting temperature solder alloys. The Sn-58Bi alloy is notable candidate …

This study experimentally investigates electrical characteristics and degradation
phenomena in polycrystalline zinc oxide thin-film transistors (ZnO-TFTs). ZnO-TFTs with Al 2 …

Hybrid bonding (or Cu-Cu direct bonding) is one of the most important interconnect
technologies for next generation 3D-packaging. Because it is an enabler for fine pad pitch …

We investigated the lattice strain of nano-twinned Cu (nt-Cu) and regular Cu redistribution
lines (RDLs) at 215, 300, 375 and 434 K using x-ray nanodiffraction; this technique has …