In this paper, we propose a thermal profile based on the finite element method (FEM). The
proposed model is used to predict the temperature profile of the Xilinx™ SPARTAN-3E Field …

A novel fully integrated dynamic thermal management circuit for system-on-chip design is
proposed. Instead of worst-case thermal management used in conventional systems, this …

This paper studies how the effectiveness of various dynamic voltage scaling mechanisms is
affected by technology scaling and system activity. We show that V/sub dd/scaling maintains …

A low-cost, high-efficiency, compact architecture of a PWM (pulse-width-modulation) drive
fan controller is designed for use in an embedded multicomputer system with an integrated …

Thermal management for nonuniform chip power integrated circuits is studied. Circuit chip
power analysis was used to generate nonuniform chip power and computational fluid …

Architectural thermal modeling of high performance VLSI systems is of special importance in
order to achieve reliable and power-saving system designs. In this paper, we present a …

<? Pub Dtl=""?> A fully analytical steady state solution is presented for the problem of 3-D
conjugate heat transfer in flip chip electronic packages with multiple general areal power …

A programmable thermal management interface circuit for PowerPC systems has been
designed, implemented, and tested for the Integrated Thermal Management (ITEM) System …

In TSV (through-silicon-via) 3D-ICs, stacking multiple dies faces a severe challenge of the
thermal effect due to the low thermal conductivity of inter-layer dielectrics and high power …

In Via thermal silicon 3D ICs, several stacked templates are facing the severe challenge of
thermal effect caused by low thermal conductivity of medium dielectrics and high energy …