Due to the continuous miniaturization and high current-carrying demands in the field of
integrated circuits, as well as the desire to save space and improve computational …

In the present study, the effect of Al 2 O 3 nanoparticles on performances of Sn–58Bi solder
were investigated in aspects of electro-migratio, shear strength and microhardness. The …

This research aimed to investigate the susceptibility of Sn-58Bi alloys to Electrochemical
Migration (ECM) when combined with TiO 2 nanoparticles tested in various solutions …

Purpose This paper aimed to investigate the effects of nano-copper particles on the melting
behaviors, wettability and defect formation mechanism of the Sn58Bi composite solder …

This work aimed to investigate the susceptibility of novel nanocomposite solder paste to
electrochemical migration (ECM). Bismuth-tin solder paste was filled with 0.1 wt.% of TiO_2 …

Electromigration is a critical reliability problem in electronic industry, especially with the
shrinkage and downscaling of microelectronic feature size, which results in gradual increase …

Purpose The purpose of this paper is to investigate the effect of titanium nitride (TiN) on
microstructure and composition of 96.5 Sn3Ag0. 5Cu (SAC305) lead-free solder joints under …

The growing use of tin-bismuth (SnBi) based low temperature solder (LTS) in the electronics
industry is driving increased research into how these metallurgies differ in behavior …

Characteristics of intermetallic compounds (IMCs) can have serious impacts on reliability of
solder joint. In the current study, Ni nanoparticles (NPs) have been added to SAC305 …

In this work, diamond nano-particles doped Sn-8Zn-3Bi solder alloys have been studied.
The microstructure and the interfacial reactions of the plain solder joints and solder joints …