Impurity and alloying effects on interfacial reaction layers in Pb-free soldering
The objective of this review is to study the effect of minor alloying and impurity elements,
typically present in electronics manufacturing environment, on the interfacial reactions …
typically present in electronics manufacturing environment, on the interfacial reactions …
A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates
The objective of this review is to study the interfacial intermatallic compounds (IMCs)
between Sn–Ag–Cu based solders and common substrates, which play a crucial role in …
between Sn–Ag–Cu based solders and common substrates, which play a crucial role in …
Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58Bi–Ag composite solders
Y Li, YC Chan - Journal of Alloys and compounds, 2015 - Elsevier
The effect of Ag nanoparticle size on the microstructure of solder matrix, microhardness,
growth of solder/Cu interfacial intermetallic compounds (IMC) and shear strength were …
growth of solder/Cu interfacial intermetallic compounds (IMC) and shear strength were …
IMC morphology, interfacial reaction and joint reliability of Pb-free Sn–Ag–Cu solder on electrolytic Ni BGA substrate
The interfacial reaction, morphology of intermetallic compound (IMC) and shear strength
between the Sn–3.5 Ag–0.7 Cu (in wt.%) solder and Ni ball grid array (BGA) substrates …
between the Sn–3.5 Ag–0.7 Cu (in wt.%) solder and Ni ball grid array (BGA) substrates …
Development of SnAg-based lead free solders in electronics packaging
L Zhang, C He, Y Guo, J Han, Y Zhang… - Microelectronics …, 2012 - Elsevier
Lead free solder alloys for electronic assembly is being driven by environmental and health
concerns regarding toxicity of lead and, more importantly, by the perceived economic …
concerns regarding toxicity of lead and, more importantly, by the perceived economic …
Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0. 3Ag0. 7Cu-CNTs solder
Carbon nanotubes (CNTs) with three different diameter ranges (10–20, 40–60, and 60–100
nm) were doped into tin-silver-copper (SAC) solder, to study the performance of the …
nm) were doped into tin-silver-copper (SAC) solder, to study the performance of the …
Mechanical properties of Sn-58 wt% Bi solder containing Ag-decorated MWCNT with thermal aging tests
The mechanical properties and microstructure of Sn-58 wt% Bi solder including various
levels of Ag-decorated MWCNTs (0, 0.05, 0.1, and 0.2 wt%) were investigated for use in …
levels of Ag-decorated MWCNTs (0, 0.05, 0.1, and 0.2 wt%) were investigated for use in …
Evolutions of the interface and shear strength between SnAgCu–xNi solder and Cu substrate during isothermal aging at 150 C
P Liu, P Yao, J Liu - Journal of alloys and compounds, 2009 - Elsevier
The interfacial evolution and shear strength of Sn3. 8Ag0. 7Cu–xNi composite solders on
organic solderability preservative (OSP) finished pad were investigated at a temperature of …
organic solderability preservative (OSP) finished pad were investigated at a temperature of …
Influence of palladium thickness on the soldering reactions between Sn-3Ag-0.5 Cu and Au/Pd (P)/Ni (P) surface finish
WH Wu, CS Lin, SH Huang, CE Ho - Journal of electronic materials, 2010 - Springer
This study provides a comparison of the influence of Pd (P) thickness on reactions during
soldering with the Sn-3Ag-0.5 Cu alloy. Soldering was carried out in an infrared-enhanced …
soldering with the Sn-3Ag-0.5 Cu alloy. Soldering was carried out in an infrared-enhanced …
Effect of iron and indium on IMC formation and mechanical properties of lead-free solder
In recent years, because of environmental concerns, lead solders have been replaced by
lead-free solders. One of the numerous lead-free solders developed in the past several …
lead-free solders. One of the numerous lead-free solders developed in the past several …