Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used
extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi …

SnBi lead-free solder is widely applied in the field of low-temperature soldering due to its
excellent creep resistance, relatively low melting point (139° C) and cost. However, the …

Three-dimensional (3D) packaging using through-Si-via (TSV) is a key technique for
achieving high-density integration, high-speed connectivity, and for downsizing of electronic …

To solve the electromigration problem of micro− electronic connection solder joints, an ideal
electromigration tester was designed, and the thickness of the intermetallic compounds …

With the miniaturization of solder joints and deterioration of serving environment, much effort
had been taken to improve the properties of Sn‐based lead‐free solders. And the fabrication …

In order to satisfy the needs of electronic industries for high-reliability joints, different kinds of
nanoparticles were incorporated into conventional Pb-free solders to enhance the …

In this study, cobalt (Co) particles were incorporated as reinforcing agents into the Sn58Bi
solder. The solderability of the solder and the strength of the solder joints were investigated …

A novel composite lead-free solder was prepared by adding Mo nanoparticles in Sn58Bi
solder. Microstructure evolution of Sn58Bi-xMo (x= 0, 0.5%, 1%)/Cu solder joints were …

Carbon nanotubes (CNTs) are being applied with increasing frequency for advanced
soldering. They have excellent mechanical, electrical, and thermal properties and are …

Purpose This paper aims to investigate the improvement of Sn58Bi solder properties by Ni
nanoparticle to provide theoretical support in the field of electronic packaging …