Metallic phase change materials offer an approach to rapidly transport heat away from a
critical device, and to store that heat using the latent heat of fusion, buffering the temperature …

Due to the high thermal conductivity and large latent heat, low melting point alloy (LMPA)
exhibits superior thermophysical properties when using as phase change material (PCM) …

In this paper, a figure of merit for the cooling capacity (FOMq) of phase change materials
(PCMs) is defined from the analytical solution of the two-phase Neumann–Stefan problem of …

In this work, we utilize a figure-of-merit (FOM) to compare the performance of various phase-
change materials (PCMs) in managing short bursts of high-power heat flux, particularly …

The trend of enhanced functionality and reducing size of mobile devices has led to a rapid
increase in power density and a potential thermal bottleneck since thermal limits of …

Thermal energy storage materials for transient thermal management applications must
exhibit large energy storage densities as well as large cooling/heating power densities. The …

Computational sprinting is a class of mechanisms that boost performance but dissipate
additional power. We describe a sprinting architecture in which many, independent chip …

Leveraging the latent heat of phase change materials (PCMs) can reduce the peak
temperatures and transient variations in temperature in electronic devices. But as the power …

Phase change materials (PCMs) are a promising passive thermal management approach for
electronic devices, offering the potential to extend device operational times and mitigate …

Phase change materials (PCMs) can effectively dampen temperature fluctuations due to
their high latent heat capacity, leading to decreased average cooling requirements in …