Recently, as the demand for high-performance computers and mobile products increases,
semiconductor packages are becoming high-integration and high-density. Therefore, in …

Composite solder alloys reinforced by different nominal concentrations of α-Fe 2 O 3
nanoparticles are examined and the performance of corresponding copper (Cu) pillar …

In this study, a 3D copper pillar bumps model was established to investigate the reliability of
the interconnection under thermal-electric coupling. In order to ensure the accuracy of the …

The morphological evolution of Cu pillars capped with Sn-1.8 wt pct Ag solder during high-
temperature annealing was investigated. Two intermetallic compounds (Cu 6 Sn 5+ Cu 3 …

Microelectronic packaging plays a vital role in semiconductor devices. With Moore's Law
nearing its limits, packaging is gaining interest to overcome the challenge. Wire bonding and …

As the advancement of transistor nodes faces unprecedented challenges and work
continues to extend Moore's law at the back end of the line (BEOL), packaging has become …