[PDF][PDF] Modeling and simulation of electrodeposition: Effect of electrolyte current density and conductivity on electroplating thickness

A Mahapatro, SK Suggu - Adv. Mater. Sci, 2018 - siriusstore.com
Electroplating or electrodeposition is a process carried out in an electrochemical cell where
a current is used to form a coating on a metal surface. Developing and optimizing conditions …

Simulation assisted design and manufacturing of anode for the hard chrome plating of components with complex geometry

D Chen, H Daoud, T Dörflinger, P Näser… - Surface and Coatings …, 2023 - Elsevier
Hard chrome plating is a widespread coating technique for applying a protective coating
layer to the surface of components. Due to the simplicity of industry-applied lead anodes …

Experimental and mathematical analysis of electroformed rotating cone electrode

H Heydari, S Ahmadipouya, AS Maddah… - Korean Journal of …, 2020 - Springer
In this study, we present results of a mathematical model in which the governing equations
of electroforming process were solved using a robust finite element solver (COMSOL …

Особенности оптимального управления гальваническими процессами в многоанодной ванне с различными значениями силы тока

ДС Соловьев, ИА Мукина… - Мехатроника …, 2017 - mech.novtex.ru
Аннотация Рассматриваются основные известные электрохимические и
геометрические подходы, а также их сочетания для снижения неравномерности …

Chemical Uniformity Impacts on Electrodeposition

JC Warner, AA Chalupa, JC Martin… - 2023 34th Annual …, 2023 - ieeexplore.ieee.org
Industrial semiconductor electrodeposition plating cells require recirculation of process
chemical with consistent flow and minimal contaminants to prevent defects from developing …

Effect of current density distribution in the zinc plating process

LO Tamara, MS Lipkin, MV Lukovkin - Solid State Phenomena, 2021 - Trans Tech Publ
This paper presents an analysis of the current density distribution in the zinc plating process,
using a two-dimension approach. The simulation presents a model based on COMSOL Multi …

Computational Study of Chemical Uniformity Impacts on Electrodeposition

A Chalupa, J Warner, J Martin - IEEE Transactions on …, 2024 - ieeexplore.ieee.org
Industrial semiconductor electrodeposition plating cells require recirculation of process
chemicals with consistent flow and minimal contaminants to prevent defects from developing …

Diseño de un Sistema Experto Difuso para la Determinación de la Densidad de Corriente en una Planta de Cromado

CV Ponce, B Rojas - Información tecnológica, 2019 - SciELO Chile
Se diseñó un sistema experto difuso, para determinar la densidad de corriente y su tiempo
de aplicación en una planta de cromado duro. Primeramente, se realiza un análisis de la …

Optimization of electroplating process parameters for uniformity control using dual neural network

오승민 - 2024 - s-space.snu.ac.kr
Electroplating is widely used in industry because it enhances the properties of materials.
Therefore, many studies have been conducted to determine the value of process parameters …

[PDF][PDF] Manufacture of copper cone shell using electroforming process and investigation of effective parameters on the process using numerical simulation

H Heidari Pebdani, H Mehmannavaz… - Metallurgical …, 2018 - metalleng.ir
The purpose of this study is to demonstrate the advantages of computer simulation and
parametric studies in improving the copper electroforming process. For this purpose, the …