Nanomaterials have promising applications in catalysis, filtration, hydrogen storage,
sensors, automobile exhaust treatment, and energy storage and conversion, etc. However …

Interconnections in semiconductor devices need to provide a seamless electrical, thermal,
and mechanical link to different parts of the circuit. Since the move away from lead-based …

Novel porous CuAlMn shape memory alloys (SMAs) with interconnected pores and
polystyrene/CuAlMn composites with uniformly distributed polystyrene were successfully …

Abstract Ti-10V-2Fe-3Al alloy specimen has been fabricated by laser melting deposition
additive manufacturing technique. Due to the repeated heating and cooling during …

Microstructures and tensile properties are essential for the practical application of
nanoporous copper (NPC), especially in areas of high request to pore distribution and …

In recent years, studies have shown that Nanoporous (NP) metals deform in a relatively
brittle manner under tensile loading. We investigated the mechanical performance of NP …

Background The demand for high-power density packaging and integration processes for
third-generation semiconductors, like silicon carbide (SiC), necessitates advancements …

Nanoporous metals have received significant attention as a new class of structural and
functional materials. However, the macroscopic brittle fracture under the tensile test is an …

To meet the higher device vibration reduction requirements, novel porous Cu 71 Al 18 Mn
11 shape memory alloys (SMAs) with controllable porosity were prepared using Cu, Al, and …

This paper reports the critical role of microstructural length scale in dealloying for the
fabrication of bimodal or monolithic functional nanoporous metal structures and the …