The pursuit of greater performance in microelectronic devices has led to a shrinkage of
bump size and a significant increase in electrical current. This has resulted in a high current …

The use of Pb-bearing solders in electronic assemblies is avoided in many countries due to
the inherent toxicity and environmental risks associated with lead. Although a number of “Pb …

The interfacial microstructures of Sn-3.0 Ag-0.5 Cu (SAC305) solder systems with thin Ni (P)
mono-coatings and Cu-Ni (P) dual-coatings were investigated after reflowing and isothermal …

Trace amount of rare earth Ce (0.03 wt.%) was added into SnAgCu solder in order to reform
the properties of the solder. In this study, interface reaction mechanism during thermal …

This study investigated the effects of adding 0.5 wt.% nano-TiO2 particles into Sn3. 5Ag0.
5Cu (SAC) lead-free solder alloys on the growth of intermetallic compounds (IMC) with Cu …

In the present study, varying weight percentages of carbon nanotubes (CNTs) were
incorporated into Sn–Ag–Cu solder matrix, to form composite solders. Isothermal aging …

The interfacial reaction, morphology of intermetallic compound (IMC) and shear strength
between the Sn–3.5 Ag–0.7 Cu (in wt.%) solder and Ni ball grid array (BGA) substrates …

The microstructure, IMCs layer and reliability of Sn-58Bi and Sn-58Bi-0.25 Mo solder joints
during thermal cycling were investigated. The results showed that the microstructure of Sn …

In nearly all soldering processes, it is the intermetallic (IMC) layer that bonds the solder to
the base metal. Thus, the IMC layer is necessary for any successful soldering operation …

A single shear lap solder joint specimen with lead-free eutectic Sn–Ag solder on copper
substrates was exposed to 1500 thermomechanical fatigue (TMF) cycles between− 15°(3.5 …