Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn–Cu solder alloy
KN Prabhu - Advances in Colloid and Interface Science, 2011 - Elsevier
Lead free solders are increasingly being used in electronic applications. Eutectic Sn–Cu
solder alloy is one of the most favored lead free alloys used for soldering in electronic …
solder alloy is one of the most favored lead free alloys used for soldering in electronic …
Interfacial reaction issues for lead-free electronic solders
The interfacial reactions between Sn-based solders and two common substrate materials,
Cu and Ni, are the focuses of this paper. The reactions between Sn-based solders and Cu …
Cu and Ni, are the focuses of this paper. The reactions between Sn-based solders and Cu …
Reaction diffusion and solid state chemical kinetics
VI Dybkov - 2010 - torrossa.com
The monograph deals with a physico-chemical approach to the problem of solid-state
growth of chemical compound layers and reaction diffusion in binary heterogeneous …
growth of chemical compound layers and reaction diffusion in binary heterogeneous …
Interfacial reaction and mechanical properties of eutectic Sn–0.7 Cu/Ni BGA solder joints during isothermal long-term aging
The interfacial reactions and growth kinetics of intermetallic compound (IMC) layers formed
between Sn–0.7 Cu (wt.%) solder and Au/Ni/Cu substrate were investigated at aging …
between Sn–0.7 Cu (wt.%) solder and Au/Ni/Cu substrate were investigated at aging …
Development of low-silver content SAC0307 solder alloy with Al2O3 nanoparticles
The present study is focused on the development of low Ag content 99Sn-0.3 Ag-0.7 Cu
(SAC0307) solder alloy with Al 2 O 3 nanoparticles reinforcement. The effects of multiple …
(SAC0307) solder alloy with Al 2 O 3 nanoparticles reinforcement. The effects of multiple …
A review: Effect of copper percentage solder alloy after laser soldering
A Abdullah, SR Aisha Idris - Soldering & Surface Mount Technology, 2023 - emerald.com
Purpose This study aims to review the effect of copper percentage in Sn-based solder alloys
(Sn-x Cu, x= 0–5 Wt.%) on intermetallic compound (IMC) formation and growth after laser …
(Sn-x Cu, x= 0–5 Wt.%) on intermetallic compound (IMC) formation and growth after laser …
Controlling interfacial reactions and intermetallic compound growth at the interface of a lead-free solder joint with layer-by-layer transferred graphene
The immoderate growth of intermetallic compounds (IMCs) formed at the interface of a
solder metal and the substrate during soldering can degrade the mechanical properties and …
solder metal and the substrate during soldering can degrade the mechanical properties and …
Interfacial reactions between Sn–0.4 Cu solder and Cu substrate with or without ENIG plating layer during reflow reaction
The interfacial reaction and morphology change of intermetallic compound (IMC) between
the Sn–0.4 wt.% Cu solder and two different kinds of substrates (Cu and electroless nickel …
the Sn–0.4 wt.% Cu solder and two different kinds of substrates (Cu and electroless nickel …
Electrodeposition of twinned Cu with strong texture effect on voiding propensity in electroplated Cu solder joints
Electrodeposition of Cu receives considerable attention due to its wide application in
microelectronic products. Sn-rich alloys are commonly used to join the electroplated Cu to …
microelectronic products. Sn-rich alloys are commonly used to join the electroplated Cu to …
Effect of adding 0.3 wt% Ni into the Sn–0.7 wt% Cu solder: Part II. Growth of intermetallic layer with Cu during wetting and aging
The growth behavior of intermetallic layer with or without adding 0.3 wt% Ni into the Sn–0.7
Cu solder was studied during the wetting reaction on Cu-substrate and thereafter in solid …
Cu solder was studied during the wetting reaction on Cu-substrate and thereafter in solid …