[HTML][HTML] Impact of TSV bump and redistribution layer on crosstalk delay and power loss
The performance of a 3D IC is primarily reliant on the selection of an appropriate bump
shape. The most prevalent bump shape (cylindrical) is experiencing substantial stress …
shape. The most prevalent bump shape (cylindrical) is experiencing substantial stress …
Sustainable packaging design for molded expanded polystyrene cushion
A molded expanded polystyrene (EPS) cushion is a flexible, closed-cell foam that can be
molded to fit any packing application and is effective at absorbing shock. However, the …
molded to fit any packing application and is effective at absorbing shock. However, the …
Prediction of pad cratering fracture at the copper pad–Printed circuit board interface
SPV Nadimpalli, JK Spelt - Microelectronics Reliability, 2012 - Elsevier
Pad-crater fracture was characterized in terms of the critical strain energy release rate, Jci,
measured at various mode ratios, ψ. Specimens were prepared from lead-free chip scale …
measured at various mode ratios, ψ. Specimens were prepared from lead-free chip scale …
A novel conditional probability density distribution surface for the analysis of the drop life of solder joints under board level drop impact
J Gu, YP Lei, J Lin, HG Fu, Z Wu - Journal of Electronic Materials, 2016 - Springer
The scattering of fatigue life data is a common problem and usually described using the
normal distribution or Weibull distribution. For solder joints under drop impact, due to the …
normal distribution or Weibull distribution. For solder joints under drop impact, due to the …
Experiment of 22FDX (R) Chip Board Interaction (CBI) in Wafer Level Packaging Fan-Out (WLPFO)
JK Cho, J Paul, S Capecchi… - 2019 IEEE 69th …, 2019 - ieeexplore.ieee.org
There is growing demand for wafer level packaging, which enables thinner, lighter, and
more cost effective packaging solutions. However, these demands come with a penalty; …
more cost effective packaging solutions. However, these demands come with a penalty; …
Chip Board Interaction Analysis of 22-NM Fully Depeleted Silicon on Insulator (FD-SOI) Technology in Wafer Level Packaging (WLP)
JK Cho, J Paul, S Capecchi, D Breuer… - 2018 International …, 2018 - ieeexplore.ieee.org
Recently, Wafer Level Packaging (WLP) has been in high demand, especially in mobile
device applications as a path to enable miniaturization while maintaining good electrical …
device applications as a path to enable miniaturization while maintaining good electrical …
[PDF][PDF] Sustainable Packaging Design for Molded Expanded Polystyrene Cushion. Materials 2023, 16, 1723
A molded expanded polystyrene (EPS) cushion is a flexible, closed-cell foam that can be
molded to fit any packing application and is effective at absorbing shock. However, the …
molded to fit any packing application and is effective at absorbing shock. However, the …
Failure analysis of the solder joints in flip-chip BGA packages under free-drop test
GZ Yuan, X Chen, XF Shu - Advanced Materials Research, 2014 - Trans Tech Publ
The failure of plastic ball grid array under intense dynamic loading was studied in the
project. This paper presents the drop test reliability results of SnPb flip-chip on a standard …
project. This paper presents the drop test reliability results of SnPb flip-chip on a standard …
[PDF][PDF] Effect of solder composition, PCB surface finish and solder joint volume on drop shock reliability
Drop shock reliability testing was performed on circuit boards assembled with several
different lead-free solder alloys including SAC305 (Sn3. 0Ag0. 5Cu). The solder …
different lead-free solder alloys including SAC305 (Sn3. 0Ag0. 5Cu). The solder …
[PDF][PDF] Memories-Materials, Devices, Circuits and Systems
S Chandrakar, D Gupta, MK Majumder - researchgate.net
The performance of a 3D IC is primarily reliant on the selection of an appropriate bump
shape. The most prevalent bump shape (cylindrical) is experiencing substantial stress …
shape. The most prevalent bump shape (cylindrical) is experiencing substantial stress …