This paper gives a review of different applications in the numerical modelling of reflow
soldering technology from recent years. The focus was on detailing the different process …

The formation and growth of an intermetallic compound (IMC) layer at the Sn–Ag–Cu
solder/Cu interface after laser soldering and during isothermal aging were investigated to …

Laser soldering has been widely used to connect electronic components to printed circuit
boards (PCBs), owing to its significant advantages, including localized heating, noncontact …

Cu-based component/aluminum substrate solder joint is achieved through laser soldering
technology in this paper. The solder wettability on aluminum substrate and microstructure …

The magnitudes of input power and scan speed of laser heat source can affect the
morphology and size of interfacial Cu 6 Sn 5 intermetallic compound (IMC) formed or grown …

This paper aims to investigate the effect of laser solder jet bonding parameters to the solder
joints in Head Gimbal Assembly. Laser solder jet bonding utilizes the fiber laser to melt …

В монографии обобщены результаты исследований и разработок в области теории,
технологии и оборудования для формирования контактных межсоединений в изделиях …

This paper presents a brief overview of numerical modelling approaches from recent years
to current soldering applications. Reflow soldering is the primary interconnecting method for …

In this paper, we present a flip-chip bonding concept for InP die on SiN-based TriPleX carrier
using laser soldering. The InP die and SiN-based TriPleX carrier include the metalization …

Flexible hybrid electronics (FHEs) have experienced many excellent developments in recent
years. However, massively assembling surface-mounted components (SMDs) on flexible …