An exemplary embodiment of the present invention discloses a light emitting diode chip
including a substrate, a light emitting structure arranged on the substrate, the light emitting …

Exemplary embodiments of the present invention disclose a light emitting diode chip
including a Substrate having a first Surface and a second surface, a light emitting structure …

CN 1.01438423 5, 2009 EP 1667241 6, 2006 EP 1521 313 12/2010 JP O7-254732 10,
1995 JP 11-126763 5, 1999 JP 11-126925 5, 1999 JP 2001-156327 6, 2001 JP 2003 …

An exemplary embodiment of the present invention relates to a light emitting diode (LED)
including a Substrate, a first nitride semiconductor layer arranged on the Substrate, an active …

(57) ABSTRACT A light emitting diode chip including a Substrate, a light emitting structure
arranged on the Substrate, the light emitting structure including an active layer arranged …

A semiconductor device comprising at least one active layer on a substrate and a first
contact to the at least one active layer, the first contact comprising a metal in contact with the …

The light emitting device includes a first semiconductor layer, a second semiconductor layer
and an active layer provided between the first semiconductor layer and the second semi …

(57) ABSTRACT A light-emitting diode chip configured to emit light of a first wavelength
range and light of a second wavelength range, including a Substrate, a light-emitting …

HOIL 29/732(2006.01)(57) ABSTRACT HOIL 2L/00(2006.01) A light emitting device includes
a first electrode layer, a HOIL 33/22(2010.01) second conductive semiconductor layer on the …

The present invention relates to a light emitting diode component (101), comprising a light
emitting semiconductor structure (104) having a top surface, and a micro-optical multilayer …