The integration of graphene with semiconductor materials has been studied for developing
advanced electronic and optoelectronic devices. Here, we propose ultrahigh …

Transparent-flexible thermoelectric thin films have immense potential as power supplies for
future small-sized consumer electronics, the internet of things, and wearable devices. Here …

Dynamic random-access memory (DRAM) devices are essential volatile memory
components in most digital devices. With the increasing demand for further low-power and …

A current approach to depositing highly plasmonic titanium nitride films using the magnetron
sputtering technique assumes that the process is performed at temperatures high enough to …

Interfacial thermal conductance (G) is of critical significance to the efficient thermal
management of two-dimensional (2D) material devices. Despite the importance of defects …

Cr doped TiN films were prepared on metal substrates via heating magnetron sputtering at
different deposition temperatures (200° C–350° C). Vacuum thermal activation energy …

(V, Mo) N is theoretically predicted to have high hardness and fracture toughness and is a
promising material for the application on protective hard coatings. However, the toughness …

Copper (Cu) is widely used for electrical conduction but the inherent resistive heating not
only wastes significant amounts of energy but also creates severe reliability issues; …

Here we investigate the interface properties of gold (Au) decorated graphenized surfaces of
4H-SiC intended for electrochemical electrodes. These are fabricated using a two-step …

The unique electronic properties of graphene, including linear electronic energy bands, a
zero-energy bandgap and carrier density tunability via externally applied voltages, make it …