Flip-Chip Aperture Coupled D-Band Active Radiator Tiles in 22-nm CMOS FDSOI

A Ayling, A Hajimiri - IEEE Journal of Solid-State Circuits, 2024 - ieeexplore.ieee.org
A D-band active radiator tile is designed in 22-nm CMOS fully depleted silicon on insulator
(FDSOI). The tile uses commercial materials, fabrication, and assembly techniques while …

The Assembly Investigation of a Multi-chip to PCB Flip-chip Package Using Cu Pillar Bumps

Z Cao, J Lehmann, B Heusdens… - IEEE Transactions …, 2024 - ieeexplore.ieee.org
This article conducts a comprehensive investigation of the assembly technologies of a Cu
pillar-based multichip flip-chip package with low-cost PCB substrates. Such a package is …