The applications of copper (Cu) and Cu-based nanoparticles, which are based on the earth-
abundant and inexpensive copper metal, have generated a great deal of interest in recent …

Solid oxide cells (SOCs) have the potential to be the most efficient energy storage and
conversion systems. To minimize energy loss due to charge and mass transport associated …

Catalyst synthesis with precise control over the structure of catalytic active sites at the atomic
level is of essential importance for the scientific understanding of reaction mechanisms and …

Atomic layer deposition (ALD) is a gas-phase deposition technique that, by relying on self-
terminating surface chemistry, enables the control of the amount of deposited material down …

Atomic layer deposition (ALD) has been receiving more and more research attention in the
past few decades, ascribed to its unrivaled capabilities in controlling material growth with …

Thermal interface materials (TIMs) with high thermal conductivity, fluidic characteristics, and
surface wettability are crucial for the effective thermal management of high-power …

The coating of complex three-dimensional structures with ultrathin metal films is of great
interest for current technical applications, particularly in microelectronics, as well as for basic …

Electrochemical reduction of CO2 using Cu catalysts enables the synthesis of C2+ products
including C2H4 and C2H5OH. In this study, Cu catalysts were fabricated using plasma …

Atomic layer deposition (ALD) has become an indispensable thin-film technology in the
contemporary microelectronics industry. The unique self-limited layer-by-layer growth …

Atomic layer deposition (ALD) of the pyrite‐type metal disulfides FeS2, CoS2, and NiS2 is
reported for the first time. The deposition processes use iron, cobalt, and nickel amidinate …