2011-12-06 Assigned to MONOLITHIC 3D INC. reassignment MONOLITHIC 3D INC.
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors …

A semiconductor circuit structure includes a support substrate which carries an interconnect
region and electronic circuitry. The semiconductor circuit structure includes a device …

A method for fabricating semiconductor memory device includes providing a first
semiconductor substrate, and forming a first storage device on the first semiconductor …

(57) ABSTRACT A semiconductor memory device includes a Substrate and an interconnect
region carried by the Substrate. A donor layer is coupled to the interconnect region through …

An information storage system includes a bonded semiconductor structure having a memory
circuit region carried by an interconnect region. The memory circuit region includes a …

A method of forming a bonded semiconductor structure circuit includes providing a support
substrate which carries a first semiconductor circuit and providing a first interconnect region …

A method includes forming a switching device which includes a vertical channel spaced
apart from a semiconductor substrate, and forming a storage device which is positioned on …

(57) ABSTRACT A bonded semiconductor structure includes a Support Sub strate which
carries a first electronic circuit, and an intercon nect region carried by the Support Substrate …

Related US Application Data now abandoned, and a continuation-in-part of applica tion No.
1 1/378,059, filed on Mar. 17, 2006, and a continuation-in-part of application No. 1 …

(57) ABSTRACT A method of forming a circuit includes providing a Substrate; providing an
interconnect region positioned on the Substrate; bonding a device structure to a surface of …