An indispensable part of our personal and working lives, computing has also become
essential to industries and governments. Steady improvements in computer hardware have …

Monolithic 3-D (M3D) integrated circuits (ICs) are an emerging technology that offer much
higher integration densities than previous 3-D IC approaches. In this paper, we present a …

The demands of future applications in computing (from self-driving cars to bioinformatics)
overwhelm the projected capabilities of current electronic systems. The need to process …

In this paper we study the power vs. performance tradeoff in block-level monolithic 3D IC
designs. Our study shows that we can close the power-performance gap between 2D and a …

The nano-scale 3D interconnects available in monolithic 3D IC technology enable ultra-high
density device integration at the individual transistor-level. In this paper we demonstrate the …

The nano-scale 3-D interconnects available in monolithic 3-D integrated circuit (IC)
technology enable ultrahigh density device integration at the individual transistor level. In …

Monolithic 3D ICs (M3D) are an emerging technology that offers an ultra-high-density 3D
integration due to the extremely small size of monolithic inter-tier vias. We explore various …

Compute-in-memory (CIM) paradigm using ferroelectric field effect transistor (FeFET) as the
weight element is projected to exhibit excellent energy efficiency for accelerating deep …

Monolithic-3D-integration (M3D) improves the performance and energy efficiency of 3D ICs
over conventional through-silicon-vias-based counterparts. The smaller dimensions of …

3-D integrated circuits (3-D ICs) are expected to have shorter wirelength, better
performance, and less power consumption than 2-D ICs. These benefits come from die …