Impurity and alloying effects on interfacial reaction layers in Pb-free soldering
The objective of this review is to study the effect of minor alloying and impurity elements,
typically present in electronics manufacturing environment, on the interfacial reactions …
typically present in electronics manufacturing environment, on the interfacial reactions …
A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates
The objective of this review is to study the interfacial intermatallic compounds (IMCs)
between Sn–Ag–Cu based solders and common substrates, which play a crucial role in …
between Sn–Ag–Cu based solders and common substrates, which play a crucial role in …
A crystal plasticity investigation of slip system interaction, GND density and stored energy in non-proportional fatigue in Nickel-based superalloy
A dislocation and gradient-based crystal plasticity finite element study of fatigue has been
carried out for nickel-based superalloy RR1000 in order to investigate detrimental non …
carried out for nickel-based superalloy RR1000 in order to investigate detrimental non …
Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples
PF Yang, YS Lai, SR Jian, J Chen, RS Chen - Materials Science and …, 2008 - Elsevier
We report in this paper Young's moduli and hardness of Cu6Sn5, Cu3Sn, and Ni3Sn4
intermetallic compounds (IMCs) measured by nanoindentation. The samples were prepared …
intermetallic compounds (IMCs) measured by nanoindentation. The samples were prepared …
Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review
As the most common of the intermetallic compounds (IMCs) formed between Sn-based
solders and Cu substrates during the packaging of integrated circuits (ICs), Cu 6 Sn 5 is …
solders and Cu substrates during the packaging of integrated circuits (ICs), Cu 6 Sn 5 is …
Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn–3.8 Ag–0.7 Cu solder joints
Intermetallic compound (IMC) growth was investigated under isothermal aging condition at
125° C for up to 500h. The evolution in the IMC morphology and microstructure were …
125° C for up to 500h. The evolution in the IMC morphology and microstructure were …
Characterization of aging effects in lead free solder joints using nanoindentation
The mechanical properties of a lead free solder are strongly influenced by its microstructure,
which is controlled by its thermal history including solidification rate and thermal aging after …
which is controlled by its thermal history including solidification rate and thermal aging after …
Joining and interconnect formation of nanowires and carbon nanotubes for nanoelectronics and nanosystems
Interconnect formation is critical for the assembly and integration of nanocomponents to
enable nanoelectronics‐and nanosystems‐related applications. Recent progress on joining …
enable nanoelectronics‐and nanosystems‐related applications. Recent progress on joining …
Theoretical explorations of structure, mechanical properties, fracture toughness, electronic properties, and thermal conductivity of Ag-doped η′-Cu6Sn5
A Yang, Y Duan, C Li, J Yi, M Peng - Intermetallics, 2022 - Elsevier
In this work, the phase stability, elasticity, fracture toughness, electronic characteristics and
thermal conductivity of Ag-doped η′-Cu 6 Sn 5 were explored based on the first-principles …
thermal conductivity of Ag-doped η′-Cu 6 Sn 5 were explored based on the first-principles …
Fatigue reliability analysis of Sn–Ag–Cu solder joints subject to thermal cycling
In this paper, thermal cycling tests and finite-element analysis (FEA) for a plastic ball grid
array package with Sn-3.8 Ag-0.7 Cu lead-free solder joints have been performed. The …
array package with Sn-3.8 Ag-0.7 Cu lead-free solder joints have been performed. The …