US 2006/0255423 A1 Nov. 16, 2006 (57) ABSTRACT (51) Int. Cl. H011, 29/47(200601) Integral structures that block the current conduction of the H01L 29/8 72(200601) built-in PiN …
MK Das, RJ Callanan, H Lin, JW Palmour - US Patent 9,640,617, 2017 - Google Patents
Int. Cl. The present disclosure relates to a power module that has a HOIL 29/6(2006.01) housing with an interior chamber and a plurality of Switch HOIL 27/06(2006.01) modules …
Edge termination for silicon carbide devices has a plurality of concentric floating guard rings in a silicon carbide layer that are adjacent and spaced apart from a silicon carbide based …
(56) References Cited 6,104,043 A 8/2000 Hermansson et al. 6,107,142 A 8, 2000 Suvorov et al. US PATENT DOCUMENTS 6,117,735 A 9, 2000 Ueno 6,121,633 A 9/2000 Singh et al …
US8680587B2 - Schottky diode - Google Patents US8680587B2 - Schottky diode - Google Patents Schottky diode Download PDF Info Publication number US8680587B2 …
R Singh - US Patent 6,673,662, 2004 - Google Patents
Edge termination for a silicon carbide Schottky rectifier is provided by including a silicon carbide epitaxial region on a voltage blocking layer of the Schottky rectifier and adjacent a …
BA Hull, Q Zhang - US Patent 8,288,220, 2012 - Google Patents
(57) ABSTRACT A method of forming a semiconductor device may include forming a terminal region of a first conductivity type within a semiconductor layer of the first conductivity …
M Bakowski, P Ranstad, JK Lim… - … on Electron Devices, 2014 - ieeexplore.ieee.org
10 kV, 2 A SiC pin diodes have been designed and fabricated. The devices feature excellent stability of forward characteristics and robust junction termination with avalanche capability …