Rational design of structures for regulating the thermal conductivities (κ) of materials is
critical to many components and products employed in electrical, electronic, energy …

Fabricating thermally conductive yet electrical insulated composite films faces dilemmas of
ineffective exfoliation of boron nitride (BN) platelets, unsatisfactory thermal conductivity (TC) …

Heat dissipation efficiency and electromagnetic interference (EMI) shielding performance
are vital to integration, miniaturization, and application of electronic devices. Flexible and …

The trend of miniaturization, integration and multi-function of modern electronics leads to the
speedily increased power density which makes heat dissipation a crucial issue. Herein …

Boron nitride/multiwalled carbon nanotubes/carbon (BN/MWCNTs/C) networks were
prepared via a rape pollen (RP) biological template assisted strategy. The highly thermally …

Owing to the unique layered structure, abundant functional groups and appropriate band
gap, carbon nitride nanosheets (CNNS) has captured extensively attention in photocatalytic …

Nowadays, the advancement of thermoconductive electromagnetic interference (EMI)
shielding materials for the next generation of electronics is in high demand. We present, in …

Owing to their miniaturization, high integration, and high power, electronic devices generate
a large amount of heat during their operation. The heat hampers normal device operation …

Epoxy resins (ERs) have extraordinary mechanical, electrical and chemical properties, and
are widely used in the aerospace, electronics and marine industries. Nonetheless, solidified …

To solve the heat diffusion problem in electronic packaging, a novel kind of irregularly
shaped hybrid filler, boron nitride@ copper (BN@ Cu), was successfully assembled via …