The electronic equipment developing towards miniaturization and high integration is facing
the danger of high heat flux and non-uniform temperature distribution which leads to the …

As the miniaturization of electronic devices continues and the heat flux increases rapidly,
thermal management techniques are facing serious challenges. Microchannel heat sinks …

Current article aims to numerically scrutinize and compare the forced convection in three
different configurations of a 3D heat sink. Two models of porous were designed aiming to …

Recent advancement in the micro-scale and nano-scale electronics systems, the demand of
an innovative solution for the thermal management to dissipate the high amount of heat flux …

This paper reviews advanced heat transfer devices utilizing advanced manufacturing
technologies, including well-established thermal management applications. Several factors …

In this study, a detailed numerical analysis of the fluid flow and heat transfer of a three-
dimensional microchannel is performed to evaluate the effect of using periodic vertical …

Porous-fin microchannel heat sinks offering high solid-fluid interfacial areas have the
potential to be an integral part of future microelectronic cooling systems. Replacing solid …

This paper describes a new design method for generating a compact heat exchanger (CHX)
computational model consisting of triply periodic minimal surface (TPMS) core structures …

Thermal modeling is the key issue in thermal management of lithium-ion battery system, and
cooling strategies need to be carefully investigated to guarantee the temperature of batteries …

Based on the synergistic design concept, double-layered microchannel heat sinks with
parallel and symmetric wavy porous fins are developed with the desire to simultaneously …