A review of mechanical properties of lead-free solders for electronic packaging
H Ma, JC Suhling - Journal of materials science, 2009 - Springer
The characterization of lead-free solders, especially after isothermal aging, is very important
in order to accurately predict the reliability of solder joints. However, due to lack of …
in order to accurately predict the reliability of solder joints. However, due to lack of …
Constitutive modeling of materials and contacts using the disturbed state concept: Part 1–Background and analysis
CS Desai - Computers & Structures, 2015 - Elsevier
Computer methods have opened a new era for accurate and economic analysis and design
of engineering problems. They account for many significant factors such as arbitrary …
of engineering problems. They account for many significant factors such as arbitrary …
Effect of thermo-mechanically induced microstructural coarsening on the evolution of creep response of SnAg-based microelectronic solders
I Dutta, D Pan, RA Marks, SG Jadhav - Materials Science and Engineering …, 2005 - Elsevier
The creep response of solder joints in a microelectronic package, which are subjected to
aggressive thermo-mechanical cycling (TMC) during service, often limits the reliability of the …
aggressive thermo-mechanical cycling (TMC) during service, often limits the reliability of the …
Measuring the mechanical properties of Pb-free solder and Sn-based intermetallics by nanoindentation
RR Chromik, RP Vinci, SL Allen, MR Notis - Jom, 2003 - Springer
The technique of nanoindentation coupled with an atomic force microscope has been used
to measure mechanical properties of Cu-Sn and Ag-Sn intermetallics at length scales similar …
to measure mechanical properties of Cu-Sn and Ag-Sn intermetallics at length scales similar …
Incremental recrystallization/grain growth driven by elastic strain energy release in a thermomechanically fatigued lead-free solder joint
AU Telang, TR Bieler, A Zamiri, F Pourboghrat - Acta Materialia, 2007 - Elsevier
A single shear lap solder joint specimen with lead-free eutectic Sn–Ag solder on copper
substrates was exposed to 1500 thermomechanical fatigue (TMF) cycles between− 15°(3.5 …
substrates was exposed to 1500 thermomechanical fatigue (TMF) cycles between− 15°(3.5 …
The role of recrystallization in the failure of SnAgCu solder interconnections under thermomechanical loading
TT Mattila, JK Kivilahti - IEEE Transactions on Components and …, 2010 - ieeexplore.ieee.org
The chip scale packaged/ball grid array component boards were thermally cycled according
to the IEC 68-2-14N standard (+ 125° C/-45° C, 15 min dwells, 5 min ramps). The as …
to the IEC 68-2-14N standard (+ 125° C/-45° C, 15 min dwells, 5 min ramps). The as …
Deformation behavior of tin and some tin alloys
F Yang, JCM Li - Journal of Materials Science: Materials in Electronics, 2007 - Springer
Plastic deformation, creep and deformation twinning of β-tin and some tin alloys related to
Pb-free solder applications are reviewed. The results are summarized and evaluated among …
Pb-free solder applications are reviewed. The results are summarized and evaluated among …
Characterizing the mechanical properties of actual SAC105, SAC305, and SAC405 solder joints by digital image correlation
This paper presents the characterization of the mechanical properties of three lead-free
solder alloys 95.5 Sn-4.0 Ag-0.5 Cu (SAC405), 96.5 Sn-3.0 Ag-0.5 Cu (SAC305), and 98.5 …
solder alloys 95.5 Sn-4.0 Ag-0.5 Cu (SAC405), 96.5 Sn-3.0 Ag-0.5 Cu (SAC305), and 98.5 …
Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling
H Chen, M Mueller, TT Mattila, J Li, X Liu… - Journal of Materials …, 2011 - cambridge.org
The failure mechanism of lead-free solder interconnections of chip scale package–sized Ball
Grid Array (BGA) component boards under thermal cycling was studied by employing cross …
Grid Array (BGA) component boards under thermal cycling was studied by employing cross …
Grain Growth Orientation and Anisotropy in Cu6Sn5 Intermetallic: Nanoindentation and Electron Backscatter Diffraction Analysis
SF Choudhury, L Ladani - Journal of Electronic Materials, 2014 - Springer
As the size of joints in micro/nano-electronics diminishes, the role of intermetallic (IMC)
layers becomes more significant. It was shown that solder joint strength is controlled largely …
layers becomes more significant. It was shown that solder joint strength is controlled largely …