Heterogeneous 2.5 D integration on through silicon interposer

X Zhang, JK Lin, S Wickramanayaka, S Zhang… - Applied physics …, 2015 - pubs.aip.org
Driven by the need to reduce the power consumption of mobile devices, and servers/data
centers, and yet continue to deliver improved performance and experience by the end …

[图书][B] Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging

XC Wei - 2017 - taylorfrancis.com
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit
Boards and Packaging presents the electromagnetic modelling and design of three major …

Interposer technologies for high-performance applications

A Usman, E Shah, NB Satishprasad… - IEEE Transactions …, 2017 - ieeexplore.ieee.org
This paper explores the current state of the art in silicon, organic, and glass interposer
technologies and their high-performance applications. Issues and challenges broadly …

Design and demonstration of power delivery networks with effective resonance suppression in double-sided 3-D glass interposer packages

G Kumar, S Sitaraman, J Cho… - IEEE Transactions …, 2015 - ieeexplore.ieee.org
Ultrathin 3-D glass interposers with throughpackage vias at the same pitch as through-
silicon vias (TSVs) have been proposed as a simpler and cheaper alternative to the direct 3 …

高速高密度PCB 电源完整性分析

闫静纯, 李涛, 苏浩航 - 2012 - chinaelectrondevices.seu.edu.cn
随着集成电路开关速度的提高以及PCB 密度的增加, 电源完整性分析已成为高速PCB
设计中不可忽略的问题. 针对电源完整性问题产生的原因和解决方法, 以一个八层高密度数模 …

[图书][B] Modeling, design, and characterization of through vias in silicon and glass interposers

T Bandyopadhyay - 2011 - search.proquest.com
During the last decade, the trend in consumer electronics has been to develop products with
better performance, smaller size, lower cost, and enhanced functionality. Convergent …

Analysis of glass interposer PDN and proposal of PDN resonance suppression methods

J Cho, Y Kim, J Kim, V Sundaram… - … IEEE International 3D …, 2013 - ieeexplore.ieee.org
Electrical characteristics of glass interposer PDN is analyzed and compared with silicon
interposer. Because of the low loss of glass substrate compared to silicon substrate, glass …

Modeling, measurement, and analysis of audio frequency ground integrity for a TDMA smartphone system

S Park, J Song, S Kim, Y Kim, M Lee… - IEEE Transactions on …, 2018 - ieeexplore.ieee.org
In this paper, we first propose a modeling method of arbitrary-shaped multilayer printed
circuit board (PCB) ground planes and chassis of smartphones in the audio frequency range …

Constructal optimization of power distribution networks for electromagnetic bandgap power plane using the generative design algorithm

B Li, Y Wang, C Xuan, K Yan - IEEE Transactions on …, 2019 - ieeexplore.ieee.org
This work explores how growth simulation may be applied to the fundamental area-to-point
(AP) optimization problems in the design of integrated circuits. To achieve this, a newly …

Coaxial through-package-vias (TPVs) for enhancing power integrity in 3D double-side glass interposers

G Kumar, PM Raj, J Cho, S Gandhi… - 2014 IEEE 64th …, 2014 - ieeexplore.ieee.org
Double-sided 3D glass interposers and packages, with through package vias (TPV) at the
same pitch as TSVs in Si, have been proposed to achieve high bandwidth between logic …