Compact thermal models of semiconductor devices: A Review

K Górecki, J Zarębski, P Górecki… - International Journal of …, 2019 - yadda.icm.edu.pl
In the paper the problem of modelling thermal properties of semiconductor devices with the
use of compact models is presented. This class of models is defined and their development …

Condition monitoring the inhomogeneous thermal fatigue of multichip IGBT module based on the thermal attenuation coefficient

J Zhang, H Shen, X Du, R Chen - IEEE Transactions on Power …, 2024 - ieeexplore.ieee.org
The multichip insulated gate bipolar transistor (IGBT) module has been widely used in the
converter with high-power capacity. However, multichip IGBT module usually suffers from …

Nonlinear compact thermal model of the IGBT dedicated to SPICE

K Górecki, P Górecki - IEEE Transactions on Power Electronics, 2020 - ieeexplore.ieee.org
In this article, the problem of modeling the thermal properties of the IGBT using a nonlinear
compact thermal model is considered. This model has the form of an electrical network. In …

[HTML][HTML] Compact modeling of a 3.3 kv sic mosfet power module for detailed circuit-level electrothermal simulations including parasitics

C Scognamillo, AP Catalano, M Riccio, V d'Alessandro… - Energies, 2021 - mdpi.com
In this paper, an advanced electrothermal simulation strategy is applied to a 3.3 kV silicon
carbide MOSFET power module. The approach is based on a full circuital representation of …

Comparative study of the parameter acquisition methods for the cauer thermal network model of an IGBT module

T An, R Zhou, F Qin, Y Dai, Y Gong, P Chen - Electronics, 2023 - mdpi.com
Under the operating conditions of high power and high switching frequency, an insulated
gate bipolar transistor (IGBT) chip can produce relatively large power loss, causing the …

Selected problems of power MOSFETs thermal parameters measurements

K Górecki, K Posobkiewicz - Energies, 2021 - mdpi.com
In the paper, selected problems that are related to the measurements of thermal parameters
of power MOSFETs that are placed on a common heat sink are analysed. The application of …

Accurate computation of IGBT junction temperature in PLECS

P Górecki, D Wojciechowski - IEEE Transactions on Electron …, 2020 - ieeexplore.ieee.org
In the article, a new method to improve the accuracy of the insulated-gate bipolar transistor
(IGBT) junction temperature computations in the piecewise linear electrical circuit simulation …

Measurements and computations of internal temperatures of the IGBT and the diode situated in the common case

P Górecki, K Gorecki - Electronics, 2021 - mdpi.com
This article proposes effective methods of measurements and computations of internal
temperature of the dies of the Insulted Gate Bipolar Transistor (IGBT) and the diode mounted …

Compact thermal model of the pulse transformer taking into account nonlinearity of heat transfer

K Górecki, K Detka, K Górski - Energies, 2020 - mdpi.com
This paper presents a compact nonlinear thermal model of pulse transformers. The
proposed model takes into account differentiation in values of the temperatures of a …

An analysis of the thermal interaction between components in power converter applications

M Shahjalal, MR Ahmed, H Lu… - IEEE Transactions on …, 2020 - ieeexplore.ieee.org
Accurately predicting the temperature of semiconductor devices is very important in the
initial design of the power electronics converter. RC thermal models derived from the well …