Self-dressing effect using a fixed abrasive platen for single-sided lapping of sapphire substrate
T Lee, H Kim, S Lee, C Park, D Kim, H Jeong - Journal of Mechanical …, 2017 - Springer
Single-sided lapping is crucial in sapphire wafering processes for improving flatness and
achieving the target wafer thickness using loose abrasives. In single-sided lapping process …
achieving the target wafer thickness using loose abrasives. In single-sided lapping process …
[PDF][PDF] 化学作用对AlN 晶体研磨过程中材料去除行为的影响
黄传锦， 顾斌， 周海， 冯伟 - Journal of the Chinese Ceramic …, 2022 - researching.cn
AlN 晶体是一种脆性难加工半导体材料. 为了高效率高质量制备AlN 晶体衬底,
设计了不同化学成分的研磨液研磨AlN 晶体, 借助激光共聚焦显微镜和X 射线光电子能谱仪研究 …
设计了不同化学成分的研磨液研磨AlN 晶体, 借助激光共聚焦显微镜和X 射线光电子能谱仪研究 …
[PDF][PDF] Conditioning parameters for maintaining plate flatness prior to lapping
PR Parate, BY Ravindra - Int. J. Mech. Eng. Rob. Res, 2014 - academia.edu
Lapping is a process, generally performed on hard metal plate used in conjunction with
abrasive suspensions such as diamond, silicon carbide, aluminum oxide or boron carbide …
abrasive suspensions such as diamond, silicon carbide, aluminum oxide or boron carbide …
Grinding performance of diamond grinding tools for sapphire crystal
Y Zhang, S Gao, RK Kang, XG Guo… - Advanced Materials …, 2014 - Trans Tech Publ
In order to improve the efficiency and reduce the cost of sapphire crystal machined by loose
abrasive lapping, the fixed-abrasive diamond grinding tools for sapphire grinding were …
abrasive lapping, the fixed-abrasive diamond grinding tools for sapphire grinding were …