Templating strategies for 3D-structured thermally conductive composites: recent advances and thermal energy applications
Thermally conductive polymer nanocomposites are enticing candidates for not only thermal
managements in electronics but also functional components in emerging thermal energy …
managements in electronics but also functional components in emerging thermal energy …
Three-dimensional interconnected networks for thermally conductive polymer composites: Design, preparation, properties, and mechanisms
With the development of science and technology, microelectronic components have evolved
to become increasingly integrated and miniaturized. As a result, thermal management …
to become increasingly integrated and miniaturized. As a result, thermal management …
Vertically aligned silicon carbide nanowires/boron nitride cellulose aerogel networks enhanced thermal conductivity and electromagnetic absorbing of epoxy …
D Pan, G Yang, HM Abo-Dief, J Dong, F Su, C Liu… - Nano-Micro Letters, 2022 - Springer
With the innovation of microelectronics technology, the heat dissipation problem inside the
device will face a severe test. In this work, cellulose aerogel (CA) with highly enhanced …
device will face a severe test. In this work, cellulose aerogel (CA) with highly enhanced …
Isotropically ultrahigh thermal conductive polymer composites by assembling anisotropic boron nitride nanosheets into a biaxially oriented network
N Zhao, J Li, W Wang, W Gao, H Bai - ACS nano, 2022 - ACS Publications
The demand for thermally conductive but electrically insulating materials has increased
greatly in advanced electronic packaging. To this end, polymer-based composites filled with …
greatly in advanced electronic packaging. To this end, polymer-based composites filled with …
Microstructured BN composites with internally designed high thermal conductivity paths for 3D electronic packaging
Miniaturized and high‐power‐density 3D electronic devices pose new challenges on
thermal management. Indeed, prompt heat dissipation in electrically insulating packaging is …
thermal management. Indeed, prompt heat dissipation in electrically insulating packaging is …
[HTML][HTML] Curcumenol triggered ferroptosis in lung cancer cells via lncRNA H19/miR-19b-3p/FTH1 axis
R Zhang, T Pan, Y Xiang, M Zhang, H Xie, Z Liang… - Bioactive materials, 2022 - Elsevier
Curcumenol, an effective ingredient of Wenyujin, has been reported that exerted its
antitumor potential in a few cancer types. However, the effect and molecular mechanism of …
antitumor potential in a few cancer types. However, the effect and molecular mechanism of …
Ice template method assists in obtaining carbonized cellulose/boron nitride aerogel with 3D spatial network structure to enhance the thermal conductivity and flame …
D Pan, J Dong, G Yang, F Su, BB Chang, C Liu… - … Composites and Hybrid …, 2022 - Springer
In the field of modern microelectronic packaging materials, there is a great need for polymer-
based composites with both excellent thermal conduction and flame retardancy properties …
based composites with both excellent thermal conduction and flame retardancy properties …
A through‐thickness arrayed carbon fibers elastomer with horizontal segregated magnetic network for highly efficient thermal management and electromagnetic wave …
Multifunctional thermal management materials with highly efficient electromagnetic wave
(EMW) absorption performance are urgently required to tackle the heat dissipation and …
(EMW) absorption performance are urgently required to tackle the heat dissipation and …
[HTML][HTML] Thermally conductive composites based on hexagonal boron nitride nanosheets for thermal management: fundamentals to applications
W Wu, M Zheng, K Lu, F Liu, YH Song, M Liu… - Composites Part A …, 2023 - Elsevier
The development of modern electronics and equipment, especially those with high power
density, has long relied on rapid heat dissipation of integrated chips, yet a challenge to date …
density, has long relied on rapid heat dissipation of integrated chips, yet a challenge to date …
High thermal conductivity and mechanical strength phase change composite with double supporting skeletons for industrial waste heat recovery
The “solid–liquid” leakage and low thermal conductivity of organic phase change materials
limit their wide range of applications. In this paper, a novel carbon fiber/boron nitride …
limit their wide range of applications. In this paper, a novel carbon fiber/boron nitride …