Multi-objective topology optimization design of silicon carbide metal oxide semiconductor field effect transistors power module liquid-cooled heatsink for electric …

X Chen, X Xu, M Li, Y Li, H Ling - Applied Thermal Engineering, 2024 - Elsevier
Silicon carbide (SiC) metal oxide semiconductor field effect transistors (MOSFETs) is
gradually replacing silicon-based insulated gate bipolar transistor (IGBT) as the switching …

[HTML][HTML] Electro-thermal co-design of a variable pole toroidal induction motor

KS Chettiar, AA Lad, H Miller, E Libbos… - Applied Thermal …, 2024 - Elsevier
Abstract The United States Department of Energy targets an 88% reduction in motor and
power electronics volume by the year 2025 while minimizing or eliminating magnet usage …

Study on the efficient heat transfer mechanism of microchannel pin-fin arrays under low pumping power

Z Sun, T Wang, B Qian, Y Wang, J Wang… - Applied Thermal …, 2024 - Elsevier
The efficient heat transfer with low pressure loss has long been a critical challenge in the
microchannel heat sinks (MCHS) design. Further study is required for the quantitative …

Experiment and simulation of supercritical hydrocarbon fuel in additively manufacture elliptical tubes

W Luo, X Tang, H Han, B Xie - Applied Thermal Engineering, 2024 - Elsevier
This study examines the supercritical hydrocarbon fuel flows through additive manufacturing
elliptical tubes using experimental and numerical method. The effects of ellipticity, AM …

Multi-objective reduced-order design optimization of single-phase liquid coolers for electronics

AA Lad, WP King, N Miljkovic - Applied Thermal Engineering, 2024 - Elsevier
Thermal management using liquid cooled cold plates is a key enabler in modern electronic
systems such as power converters and multi-chip arrays. Traditional cold plate designs are …

Thermal and hydraulic performance of 3D printed jet impingement configuration for SiC power modules in aerospace propulsion inverters

M Hefny, S Hemming, L Zhou, D Wang… - Thermal Science and …, 2024 - Elsevier
Efficiently controlling the temperature of power electronic inverters is crucial for aerospace
applications with high power density. Effective thermal management strategies could …

Performance enhancement of topology-optimized liquid-cooled heat sink with increased spanwise length of design domain

V Pandey, M Law, R Whenish, KR Heng… - International Journal of …, 2024 - Elsevier
Topology optimization generate promising 'heat sink fin layouts' to satisfy the thermo-
hydraulic objectives with lightweight designs. This article evaluates the performance of …

An Innovative Additively Manufactured Design Concept of a Dual-Sided Cooling System for SiC Automotive Inverters

EE Abramushkina, GE Martin, A Sen, S Jaman… - IEEE …, 2024 - ieeexplore.ieee.org
Modern Electric Vehicles (EVs) require high power and high efficient powertrains to extend
their power range. A key element of the electric powertrain is its drive with an electric motor …

Fin Design Topology Optimization for Direct Liquid Cooling of Multi-Chip Power Modules

AA Lad, E Roman, Y Zhao, WP King… - IEEE Transactions on …, 2024 - ieeexplore.ieee.org
This article demonstrates the use of topology optimization (TO) to generate optimal fin
designs capable of high heat flux removal without increasing the pumping power. We use …

A Computational Multiscale Modeling Method for Nanosilver-Sintered Joints with Stochastically Distributed Voids

Z Sun, W Guo, AB Jørgensen - Journal of Electronic Materials, 2024 - Springer
A high power density is required in wide band gap power semiconductor packaging, which
has led to the popularity of sintered nanosilver as an interconnecting material. However …