This paper offers a short overview of epoxy resins, encompassing their diverse
characteristics, variants, chemical modifications, curing processes, and intriguing electrical …

Dielectric materials with high thermal conductivity (TC) can enable disruptive performance
enhancement in the areas of electronics packaging, thermal management, energy storage …

As the power density of the electronics is on increasing, improving the heat dissipation
performance of electronic packaging materials will play a positive role in promoting the …

Polymer-based composites with efficient thermal energy dissipation performance can be
prospectively applied in electronics and military industry. However, significantly improving …

Heat dissipation problem is the primary factor restricting the service life of an electronic
component. The thermal conductivity of materials has become a bottleneck that hinders the …

In this article, flexible and rigid polyurethane (PU)/copper (Cu) composites are prepared via
a simple and cost‐effective solution casting process. The filler dispersion and chemical …

In this study, the synergistic effect of hexagonal boron nitride (h-BN) with cubic boron nitride
(c-BN) on enhancement of thermal conductivity of epoxy resin composites has been …

In this study, a hybrid filler comprising cellulose nanofiber (CNF) and boron nitride (BN)(CNF-
BN) was fabricated through the ball milling exfoliation method by introducing oxalic acid to …

Reducing thermal expansion and improving thermal conductivity of copper based materials
are particularly important for improving thermal stability of electronic packaging materials …

In this paper, based on phytic acid (PA), chitosan (CS) and tetrapod zinc oxide (TZ), a
biobased flame retardant material (TZ@ PA@ CS) was synthesized by solution self …