A review of advances in pixel detectors for experiments with high rate and radiation
M Garcia-Sciveres, N Wermes - Reports on Progress in Physics, 2018 - iopscience.iop.org
The large Hadron collider (LHC) experiments ATLAS and CMS have established hybrid
pixel detectors as the instrument of choice for particle tracking and vertexing in high rate and …
pixel detectors as the instrument of choice for particle tracking and vertexing in high rate and …
Hybrid pixel readout integrated circuits
M Garcia-Sciveres - Nuclear Instruments and Methods in Physics Research …, 2023 - Elsevier
This is one of several articles in a special volume devoted to micro-electronics in the field of
High Energy Particle Physics, reviewing readout integrated circuits for hybrid pixel detectors …
High Energy Particle Physics, reviewing readout integrated circuits for hybrid pixel detectors …
Microsystems using three-dimensional integration and TSV technologies: Fundamentals and applications
Z Wang - Microelectronic Engineering, 2019 - Elsevier
As a powerful enabling technology, three-dimensional (3D) integration, which uses wafer
bonding to integrate multiple wafers in the vertical direction and uses through‑silicon-vias …
bonding to integrate multiple wafers in the vertical direction and uses through‑silicon-vias …
Single Photon Counting Readout IC With 44 e− rms ENC and 5.5 e− rms Offset Spread With Charge Sensitive Amplifier Active Feedback Discharge
The paper presents the design and measurements of a low noise integrated circuit in a
CMOS 130 nm for the readout of a hybrid pixel detector operating in a single photon …
CMOS 130 nm for the readout of a hybrid pixel detector operating in a single photon …
Thermal and electrical performance of direct bond interconnect technology for 2.5 D and 3D integrated circuits
Currently thermo-compression bonding (TCB) of solder capped micro bumps is the industry
standard for high bandwidth memory (HBM) packaging. However, the assembly complexity …
standard for high bandwidth memory (HBM) packaging. However, the assembly complexity …
Single Photon-Counting Pixel Readout Chip Operating Up to 1.2 Gcps/mm2 for Digital X-Ray Imaging Systems
This paper presents the design of a PXF40-an ultrafast single photon-counting (SPC)
readout front-end electronics implemented in a CMOS 40-nm technology dedicated to hybrid …
readout front-end electronics implemented in a CMOS 40-nm technology dedicated to hybrid …
Characterization of the photon counting CHASE Jr., chip built in a 40-nm CMOS process with a charge sharing correction algorithm using a collimated X-ray beam
A Krzyżanowska, GW Deptuch, P Maj… - … on Nuclear Science, 2017 - ieeexplore.ieee.org
This paper presents the detailed characterization of a single photon counting chip, named
CHASE Jr., built in a CMOS 40-nm process, operating with synchrotron radiation. The chip …
CHASE Jr., built in a CMOS 40-nm process, operating with synchrotron radiation. The chip …
Fast timing with induced current detectors
R Lipton, J Theiman - Nuclear Instruments and Methods in Physics …, 2019 - Elsevier
Vertically integrated (3D) combinations of sensors and electronics provide the ability to
fabricate small, fine pitch pixels with very small total capacitance monolithically integrated …
fabricate small, fine pitch pixels with very small total capacitance monolithically integrated …
Active feedback with leakage current compensation for charge sensitive amplifier used in hybrid pixel detector
We report on the design of an active feedback circuit for charge sensitive amplifiers used for
reading out hybrid pixel detectors. The predominant advantages of the proposed feedback …
reading out hybrid pixel detectors. The predominant advantages of the proposed feedback …
Direct Cu to Cu bonding and other alternative bonding techniques in 3D packaging
T Suga, R He, G Vakanas, A La Manna - 3D Microelectronic Packaging …, 2017 - Springer
This chapter provides insights into direct Cu to Cu bonding and summarizes several critical
empirical results. After comparing the solder-less Cu–Cu bonding with the solder-based …
empirical results. After comparing the solder-less Cu–Cu bonding with the solder-based …