(57) ABSTRACT A method for manufacturing a semiconductor device is provided. The
method includes forming a plurality of light emitting elements on a first substrate and forming …

(57) ABSTRACT A Micro LED display panel, a method for fabricating the Micro LED display
panel and a display device are provided. When the LED chip array is transferred, it may only …

There is provided a display device. The display device includes a plurality of semiconductor
elements disposed on a substrate; a plurality of LEDs disposed on the plurality of …

A manufacturing method of a display including the following steps is provided. Firstly, a back
plate, a first transfer platform and a second transfer platform are provided, wherein a plurality …

US10468394B1 - Display device - Google Patents US10468394B1 - Display device - Google
Patents Display device Download PDF Info Publication number US10468394B1 US10468394B1 …

(57) ABSTRACT A micro LED display panel able to display images from opposite surfaces
includes a substrate, a pixel circuit layer on the substrate, an insulating layer on the pixel …

Disclosed herein are techniques for wafer-to-wafer bonding for manufacturing light emitting
diodes (LEDs). In some embodiments, a method of manufacturing LEDs includes modifying …

US11949045B2 - Light emitting element structure and method of fabricating a light emitting
element - Google Patents US11949045B2 - Light emitting element structure and method of …

BACKGROUND LEDs are fabricated on a separate substrate. The LEDs are 20 transferred
to an intermediate substrate and the original With the development of Mini LED and Micro …

LED can be made very accu ccurately and efficiently. First, after epitaxial process, the LED
epi-wafer is processed into micro LEDs. Second, bonding substrates with driving circuits are …