Advanced packaging featuring vertical integration has emerged as a crucial technology
facilitating high performance, low power consumption, and compatibility for heterogeneous …

The metal-metal bonding has become more promising for fine-line hermitic sealing and
electronic packaging applications. Even though aluminum has CMOS compatibility and …

Heterogeneous integration of micro-electro mechanical systems (MEMS) and
complementary metal oxide semiconductor (CMOS) integrated circuits (ICs) by 3D stacking …

Aluminum has a great potential as a wafer bonding material due to its inherent compatibility
with the complimentary metal oxide semiconductor (CMOS) processes. In this study, a novel …

This paper presents a surface-activated Al-Al wafer bonding process for patterned 200 mm
wafers that removes the native oxide in an argon plasma and enables high bond quality with …

This work presents a collective die to wafer (D2W) bonding concept based on surface-
activated aluminum–aluminum (Al–Al) thermocompression bonding, which involves the …

Wafer bonding is crucial in semiconductor manufacturing, integrating diverse materials and
creating complex devices. Aluminum thermo-compression bonding (Al TCB) is promising for …

Heterogeneous integration of micro-electro mechanical systems (MEMS) and
complementary metal oxide semiconductor (CMOS) integrated circuits (ICs) by 3D stacking …