Over the past decade, the primary focus for improving the performance of nano-electronic
metal interconnect structures has been to reduce the impact of resistance-capacitance (RC) …

This review paper is part of a series of papers dedicated to the centenary celebration of the
American Chemical Society Division of Polymeric Materials: Science and Engineering which …

Design for Manufacturability and Statistical Design: A Constructive Approach provides a
thorough treatment of the causes of variability, methods for statistical data characterization …

The short-ranged bonding structure of organosilicate glasses can vary to a great extent and
is directly linked to the mechanical properties of the thin film material. The combined action …

Adhesion physics was relegated to the lowest echelons of academic pursuit until the advent
of three seemingly disconnected events. The first, atomic force microscopy (AFM), eventually …

The combined effect of moisture and mechanical loading on asphalt mixtures has been
recognized as one of the main causes of premature deterioration of flexible pavements. This …

This paper describes a framework to study the initiation and arrest of an interfacial crack,
using a combination of experiment and computation. We consider a test configuration widely …

Continued reduction in resistance-capacitance (RC) delays in nano-electronic Cu
interconnect structures will require new materials with increasingly lower dielectric constants …

Thin Films and Coatings: Toughening and Toughness Characterization captures the latest
developments in the toughening of hard coatings and in the measurement of the toughness …

Double cantilever beam (DCB) tests were conducted by immersing the specimens in
temperature-controlled water while applying a creep load using a spring. By introducing a …