Thermal conductivity of carbon nanotube networks: A review

B Kumanek, D Janas - Journal of materials science, 2019 - Springer
Depending on their structure and order (individual, films, bundled, buckypapers, etc.),
carbon nanotubes (CNTs) demonstrate different values of thermal conductivity, from the …

Strategies for enhancing thermal conductivity of polymer-based thermal interface materials: A review

H Ma, B Gao, M Wang, Z Yuan, J Shen, J Zhao… - Journal of Materials …, 2021 - Springer
Thermal management has been considered as a key issue for high-power electronics.
Thermal interface materials (TIMs) play an extremely important role in the field of thermal …

[HTML][HTML] A review of carbon-based thermal interface materials: Mechanism, thermal measurements and thermal properties

X Guo, S Cheng, W Cai, Y Zhang, X Zhang - Materials & Design, 2021 - Elsevier
With the development of electronic technologies, electronic devices become smaller, while
their power density increases dramatically. The resulting excessive heat requires excellent …

A review on advanced carbon-based thermal interface materials for electronic devices

J Khan, SA Momin, M Mariatti - Carbon, 2020 - Elsevier
Electronic devices play a vital role in our lives and are expected to play an even bigger role
in the future considering their immense contribution in every field. Current trends are drifting …

Present and future thermal interface materials for electronic devices

KM Razeeb, E Dalton, GLW Cross… - International Materials …, 2018 - Taylor & Francis
Packaging electronic devices is a growing challenge as device performance and power
levels escalate. As device feature sizes decrease, ensuring reliable operation becomes a …

Thermal transport in 3D nanostructures

H Zhan, Y Nie, Y Chen, JM Bell… - Advanced Functional …, 2020 - Wiley Online Library
This work summarizes the recent progress on the thermal transport properties of 3D
nanostructures, with an emphasis on experimental results. Depending on the applications …

Review of thermal packaging technologies for automotive power electronics for traction purposes

J Broughton, V Smet… - Journal of …, 2018 - asmedigitalcollection.asme.org
Due to its superior electrical and thermal characteristics, silicon carbide power modules will
soon replace silicon modules to be mass-produced and implemented in all-electric and …

[PDF][PDF] Recent advances in thermal interface materials

Y Zhou, S Wu, Y Long, P Zhu, F Wu, F Liu… - ES Materials & …, 2020 - espublisher.com
In recent years, miniaturization and integration have become the development trends of
electronic devices. With the power of electronic devices continuing to increase, the amount …

A review of aligned carbon nanotube arrays and carbon/carbon composites: fabrication, thermal conduction properties and applications in thermal management

Z Dong, B Sun, H Zhu, G Yuan, B Li, J Guo, X Li… - New Carbon …, 2021 - Elsevier
The development of modern technology has posed greater and more urgent needs for
thermal management materials. Aligned carbon nanotube arrays and carbon/carbon …

Silicon carbide converters and MEMS devices for high-temperature power electronics: A critical review

X Guo, Q Xun, Z Li, S Du - Micromachines, 2019 - mdpi.com
The significant advance of power electronics in today's market is calling for high-
performance power conversion systems and MEMS devices that can operate reliably in …