The feasibility of an ultrathin dual-barrier scheme to inhibit interfacial diffusion and reactions in contact stacks of Co/NiSi/Si
CN Hsiao, YC Pan, WC Chen, YL Cheng, JS Fang… - Surfaces and …, 2024 - Elsevier
Self-assembled monolayers (SAMs) and self-forming barriers (SFBs) are highly effective
barriers of copper (Cu) interconnect systems. However, the barrier capability of SAMs and …
barriers of copper (Cu) interconnect systems. However, the barrier capability of SAMs and …
Enhancement of electromigration reliability of electroless-plated nanoscaled copper interconnects by complete encapsulation of a 1 nm-thin self-assembled …
GS Chen, CE Lee, YL Cheng, JS Fang… - Journal of The …, 2022 - iopscience.iop.org
The downsizing of integrated circuits for the upcoming technology nodes has brought
attention to sub-2 nm thin organic/inorganic materials as an alternative to metallic …
attention to sub-2 nm thin organic/inorganic materials as an alternative to metallic …
Electrical Characteristics and Reliability of SiCN/Porous SiOCH Stacked Dielectric: Effects of Deposition Temperature of SiCN Film
YL Cheng, YL Lin, WF Peng, CY Lee… - ECS Journal of Solid …, 2021 - iopscience.iop.org
Silicon carbonitride (SiCN) films deposited using silazane singe-precursor with different
temperatures were capped onto porous carbon-doped silicon oxide (p-SiOCH) dielectric …
temperatures were capped onto porous carbon-doped silicon oxide (p-SiOCH) dielectric …
The Encaging of Cobalt Interconnect Lines with an Orderly Amino-Based Sam for Electromigration Mitigation Using an All-Wet Electroless Process
JS Fang, W Lee, YL Cheng, CI Lin… - Giin-Shan, The Encaging of … - papers.ssrn.com
A self-assembled monolayer (SAM)-encaged Cu interconnect serving as a barrier layer has
been well-developed to enhance thermal stability and electromigration reliability for …
been well-developed to enhance thermal stability and electromigration reliability for …