Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods
In this paper, we present the thermal cycling test results for edge and corner bonded lead-
free PSvfBGAs on a high-Tg test board. The test results show that the characteristic lives of …
free PSvfBGAs on a high-Tg test board. The test results show that the characteristic lives of …
Board-level shear, bend, drop and thermal cycling reliability of lead-free chip scale packages with partial underfill: a low-cost alternative to full underfill
Full capillary flow underfill (FCFU) has been proven to be effective in improving the board-
level mechanical reliability of lead-free (LF) area array packages (AAPs). However, the …
level mechanical reliability of lead-free (LF) area array packages (AAPs). However, the …
A comprehensive analysis of the thermal cycling reliability of lead-free chip scale package assemblies with various reworkable board-level polymeric reinforcement …
H Shi, C Tian, D Yu, T Ueda - 2012 13th International …, 2012 - ieeexplore.ieee.org
The low coefficient of thermal expansion (CTE), high modulus and high glass transition
temperature (T g) underfills with silica filler have been successfully used for extending the …
temperature (T g) underfills with silica filler have been successfully used for extending the …
Investigation on the optimum sampling rate of strain measurement during printed circuit board (PCB) system assembly
HB Shi, T Ueda - 2011 IEEE 13th Electronics Packaging …, 2011 - ieeexplore.ieee.org
This paper discusses the Min. sampling rate of strain measurement during the system
assembly process. The test boards including the server, desktop computer and laptop …
assembly process. The test boards including the server, desktop computer and laptop …
Polymeric reinforcement approaches and materials selection to improve board-level drop reliability of SnAgCu soldered area array packages
The board-level drop performance of area array package (AAP) assemblies is becoming
increasingly critical due to the shift from desktop to mobile computing. Furthermore …
increasingly critical due to the shift from desktop to mobile computing. Furthermore …