Sn-based lead-free solder alloys have been investigated widely to replace the traditional Sn–
Pb solder alloys. Since the miniaturization of electronic products and the expansion of …

Without introducing extraneous elements, a small amount of Nd is introduced into rare-earth
WE43 magnesium alloy by ion implantation. The surface composition, morphology …

The corrosion behavior of Fe and Bi added Sn-0.7 Cu solder was investigated in 3.5 wt%
NaCl solution. Addition of Fe and Bi results in higher corrosion current density, reduction in …

This paper reviewed the wetting properties of solder for microelectronic packaging. The
recent demand for high-density packaging has highlighted the need for a sophisticated and …

Abstract In this work, FeCrCoAlMn 0.5 Mo 0.1 high-entropy alloy (HEA) coating was
successfully synthesized on 316L stainless steel by ultrasonic assisted laser cladding. The …

Electrochemical corrosion behavior of Sn–Zn solder alloys in aerated and quiescent 0.5 M
NaCl solution was investigated by electrochemical impedance spectroscopy (EIS) and …

Cobalt (Co) and graphene oxide/cobalt (GO/Co) composite coatings were fabricated by
pulse electrodeposition technique from an aqueous bath containing cobalt sulfate and GO …

Various electronic equipment has been exposed to a very harsh atmospheric condition that
results in corrosion of the solders inside it. The type of corrosion, in most cases, is …

In this paper, a new underwater processing technology was proposed, called underwater
wet laser cladding (UWLC). Protective material assisted UWLC was provided to increase the …

The corrosion properties of lead-free solder alloy can not be ignored in the field of the
electronic industry. However, there is no literature on the effect of aluminium on Sn-In binary …