Fingerprint sensor in an electronic device
M Yousefpor, JM Bussat, BB Lyon, G Gozzini… - US Patent …, 2018 - Google Patents
A fingerprint sensor is incorporated in a display stack in an electronic device. A single
fingerprint can be captured at one time at a single pre-defined fixed location on a display …
fingerprint can be captured at one time at a single pre-defined fixed location on a display …
Biometric sensor stack structure
SA Myers - US Patent 9,697,409, 2017 - Google Patents
Various structures and methods are disclosed for packaging a biometric sensor, such as a
capacitive biometric sensor. Embodiments incorporate various placements of the biometric …
capacitive biometric sensor. Embodiments incorporate various placements of the biometric …
Integrated circuit device including through-silicon via structure and decoupling capacitor and method of manufacturing the same
J Park, SH Kang, K Moon, B Park, SC Bang - US Patent 9,691,684, 2017 - Google Patents
2014-07-09 Assigned to SAMSUNG ELECTRONICS CO., LTD. reassignment SAMSUNG
ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT …
ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT …
Capacitive sensing array modulation
SP Hotelling, JM Bussat, BB Lyon - US Patent 9,740,343, 2017 - Google Patents
A capacitive fingerprint sensor that may be formed of an array of sensing elements. Each
capacitive sensing element of the array may register a voltage that varies with the …
capacitive sensing element of the array may register a voltage that varies with the …
Process for producing a through-silicon via and a through-silicon capacitor in a substrate, and corresponding device
JP Colonna, S Joblot, T Mourier, O Guiller - US Patent 9,224,796, 2015 - Google Patents
(57) A device includes a Substrate and an integrated-circuit inter connect on a first side. A
capacitor passes through the Sub strate possessing a first electrode having a first contact …
capacitor passes through the Sub strate possessing a first electrode having a first contact …
Metal-insulator-metal (MIM) capacitor in redistribution layer (RDL) of an integrated device
S Gu, RD Lane, GD Raskin, SK Pandey - US Patent 9,577,025, 2017 - Google Patents
Some features pertain to an integrated device that includes a Substrate, several metal layers
coupled to the Substrate, several dielectric layers coupled to the substrate, and a …
coupled to the Substrate, several dielectric layers coupled to the substrate, and a …
Capacitive fingerprint sensor including an electrostatic lens
JM Bussat - US Patent 9,460,332, 2016 - Google Patents
US9460332B1 - Capacitive fingerprint sensor including an electrostatic lens - Google Patents
US9460332B1 - Capacitive fingerprint sensor including an electrostatic lens - Google Patents …
US9460332B1 - Capacitive fingerprint sensor including an electrostatic lens - Google Patents …
Capacitive sensor packaging
BJ Pope, S Arnold, BJ Corlett, TL Gilton… - US Patent …, 2017 - Google Patents
An apparatus comprises a fingerprint sensor having a set of capacitive elements configured
for capacitively coupling to a user fingerprint. The fingerprint sensor may be disposed under …
for capacitively coupling to a user fingerprint. The fingerprint sensor may be disposed under …
Biometric sensor chip having distributed sensor and control circuitry
MS Bhagavat, J Zhai - US Patent 9,883,822, 2018 - Google Patents
A sensor includes a sensor array formed on a first side of a substrate and at least one circuit
operative to communicate with the sensor array formed on a second side of the substrate. At …
operative to communicate with the sensor array formed on a second side of the substrate. At …
Capacitive sensing array modulation
SP Hotelling, JM Bussat, BB Lyon - US Patent 9,880,675, 2018 - Google Patents
A capacitive fingerprint sensor that may be formed of an array of sensing elements. Each
capacitive sensing element of the array may register a voltage that varies with the …
capacitive sensing element of the array may register a voltage that varies with the …