The characteristics of networks formed in cured 'reworkable'epoxy thermosets capable of
controlled thermal degradation were studied. Dynamic mechanical thermal analysis …

In recent years, several research groups have created reworkable thermoset systems. A
prominent use of such materials is in microelectronics packaging areas to enable the repair …

Thermosetting resin compositions are provided that are useful for mounting onto a circuit
board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid …

An electrochemically disbondable composition is provided having a matrix functionality and
an electrolyte functionality wherein the electrolyte functionality is provided by a block …

The present invention relates to assemblies for connecting circuitry. More particularly, the
invention relates to mount ing assemblies and methods for providing electrical connec tion …

The thermal decrosslinking behavior of an acrylic polypropylene oxide polymer network was
studied in the presence of various basic and non-basic species. The study determined that …

[73] Assignee: International Business Machines 12 & Tl? e Page Jan" 1968
Relssue'Corporation, Afmonk, N~ Y~ March, J. Advanced Organic Chemistry, pp. 329—331 …

The rework of packages is a standard practice in surface mount technology (SMT) assembly.
The reasons for rework include process yields, failed parts, and field returns. The …

A thermoset resin, including the reaction product of: an epoxy resin mixture including at least
one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; …

The carbon fiber forming raw material is a carbon fiber forming raw material (Z) as a prepreg
including sizing agent-coated carbon fibers and a thermosetting resin or a carbon fiber …